Habib Badri, PhD Personal:
Name: Badri Ghavifekr First name: Habib Tel: 0098-(0)412 345 9375 Fax: 0098-(0)412 344 4322 E-mail: badri@sut.ac.ir Professional Experience:
1998 - 2005 Research Assistant Fraunhofer Institute IZM, Institute for Reliability and Microintegration Field of Activities: Microsystem Technologies, Microelectronic Packaging Technologies
1994 - 1996 Technical Assistant Fraunhofer Institute IZM, Institute for Reliability and Microintegration Field of Activities: Microelectronic Packaging, Laser Montage Technique FPC
1996 - 1998 Scientific Assistant BeCAP: Field of Activities: Microsystem Technologies
1993 Technical Trainee MAT: Field of Activities: MEMS, Manufacturing of mSensors
1991 - 1993 Technical Assistant Andus Electronics, Education:
PHD. Electrical Engineering Feb. 2004 Field of Research: Microsystem Technologies
Thesis: Application of fracture mechanical integral concepts on the thermo-mechanical reliability estimation by microelectronic packaging technology BSC. & MSC. Electrical Engineering Jan- 1996 Fields of Study: Microsystem Technologies
- Microelectronic Packaging Technologies, - MEMS Technology (Design and Fabrication of mSensors), - Integrated Circuit Thesis 1: Design and Manufacturing of a Silicon based Pressure mSensor Thesis 2: Finite Element Analyze and Optimization of the Laser Montage Method FPC BSC. Oct. 1988 Electrical Engineering
Field of Study: Electronics
Language:
German, English, Farsi, Turkish (Azari)
Teaching Experience:
Assistant Professor, Sahand University of Technology, Tabriz, Iran,
Since Sep. 2005.
- Theory and Technology of Semiconductor Devices (M.Sc.)
- Microelectromechanical Systems MEMS (M.Sc.)
- Advance Electronic Measurement Techniques I, II (M.Sc.) - Electronic Measurement Techniques (B.Sc.)
- Instrumentation (B.Sc.)
- Engineering Electromagnetics (B.Sc.)
M.Sc. Thesis Supervised:
1 W. Tahmasbi; “High Directive Microstrip Antenna using Metamaterials, Design and Construction”, Co-supervisor: Dr. G. Dadashzadeh, Sahand University of Technology, 2007 2 M. Mottaghi; “Design of a Sensor based on MEMS Technology for Integration into Surgical Handpiece”, Co-supervisor: Dr. F. Ghalichi, Sahand University of Technology, 2009 3 M. Baghelani; “A New High Reliable Structure of Microelectromechanical Radial Contour Mode Disk Resonator for UHF Application”, Publications:
1 M. Mottaghi, F. Ghalichi, H. Badri Ghavifekr; Design of a MEMS Sensor for Surgical Handpiece, International Conference on Microelectronics ICM08, Sharjah, UAE, 2008 2 M. Mottaghi, F. Ghalichi, H. Badri Ghavifekr; Dual Comb Unit High-g Accelerometer Based on CMOS-MEMS Technology, Sensors and Transducers, Vol. 103, Issue 4, April 2009 3 M. Baghelani, H. Badri Ghavifekr; New Design of RF MEMS Disk Resonators and Optimization for Spurious Modes, European Conference on Circuit Theory and Design ECCTD09, Antalya, Turkey, 2009 1 R. Ehrlich, K.-F. Becker, H. Badrighavifekr, F. Ansorge, R. Aschenbrenner, H.Reichl, K. Sawai, A. Tanaka, K. Kumano, Y. Tenya, M. Cichon, H.Hosokawa; Reliability Aspects of Molded BGA's related to Material Properties, Proc. EuPac 98, Nuremberg, Germany 2 F. Ansorge, H. Badrighavifekr, E. Jung, J. Kloeser, E. Zakel, H. Reichl; Reliability of COB Technology: A Comparison of Chip and Wire and Flip Chip Assembly; in Proc. Microsystem Technologies, 1996, Potsdam, Germany 3 J. Auersperg, H. Badrighavifekr, E. Kieselstein, T. Winkler, A. Schubert, B.Michel; Fracture and Damage Investigations Enhancing the Thermo-Mechanical Reliability of Plastic Packages; Poly 99, Applications, Paris, France, Dec. 12-15, 1999, EEP-Vol. 27 4 J. Auersperg, H. Badrighavifekr, E. Kieselstein, A. Schubert, B.Michel; Interface Toughness Evaluation for Flip Chip and CSP Assemblies based on Fracture Mechanics Approaches; EMRS-Meeting 2001, Strasbourg, France, June 5-8, 2001 5 H. Badri Ghavifekr, B. Michel; Generalized Fracture Mechanical Integral Concept JG Applied to SMT Components. Materials Week, Int. Conf. on Advanced Materials, their Processes and Application, 6 H. Badri Ghavifekr, B. Michel; Generalised Fracture Mechanical Integral Concept JG and its Application in Microelectronic Packaging Technology, Sensors and Actuators A99, Elsevier, 2002, p 183-187 7 H. Badri Ghavifekr, B. Michel; Application of the Generalized Fracture Mechanical Integral Concept JG in Microelectronic Packaging Technology. Materials Week, Int. Conf. on Advanced Materials, their Processes and Application, 8 H. Badri Ghavifekr; Einsatz bruchmechanischer Integralkonzepte zur Zuverlaessigkeitsbewertung in der mikroelektronischen Aufbau- und Verbindungstechnik. Dissertation, Technical University Berlin, Feb. 2004, |
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Design & Maintenance:
Ali Charchi Copyright 2005, Sahand University of Technology, All rights reserved. |